張一慧檢視原始碼討論檢視歷史
| 張一慧 |
2011年在清華大學航天航天學院工程力學系獲博士學位;2011年至2015年在美國西北大學土木與環境工程系先後擔任Postdoctoral Fellow和Research Assistant Professor。2017年獲得國家自然科學基金委優秀青年基金資助。曾獲"科學探索獎"[1]、麻省理工學院技術評論"全球35位35歲以下創新者"、美國機械工程師協會Thomas J.R. Hughes青年學者獎、國際工程科
基本信息
人物說明----清華大學航天航空學院工程力學系教授
外文名稱----Yihui Zhang
國 籍 ---- 中國
職 業 ---- 教育科研工作者
畢業院校----清華大學;南京航空航天大學
職 稱 ---- 教授
教育背景
2002.9-2006.6南京航空航天大學飛行器設計與工程專業學士
2006.8-2008.7 清華大學 工程力學碩士
2008.9-2011.6 清華大學 工程力學博船鴉櫃寒士
工作履歷
2011.10-2014.6 美國西北大學，土木與環境工程系 Postdoctoral Fellow
2014.6-2015.3 美國西北大學，土木與環境工程系 Research Assistant Professor
2015.3-2019.12 清華大學，工程力學系 副教授/長聘副教授
2019.12-至今 清華大學，工程力學系 長聘教授
研究領域
力學引導的三維微結構組裝，非常規軟材料，柔性可延展電子器件，智能材料與結構力學。
研究概況
致力於利用力學原理和多學科交叉解決世界科技前沿領域中的挑戰性科學問題，在此過程中建立先進材料和結構的新力學理論和計算模型, 並發展具有特異性能的材料和系統的設計及製造方法。當前的主要研究焦點是柔性微結構技術，側重於發紙挨鴉展能夠重現或超越生物軟組織力學/物理性能的結構化軟材料，以及能夠提供新功能或高性能的三維微電子器件。
1. 建立力學引導的微尺度三維結構組裝新方法，提出力學設計新概念，建立三維組裝的大變形理論、計算力學方法、實驗技術及反問題設計方法，發展該方法在三維微電子器件、微機電系統及電磁器件中的新型應用;
2. 發展具有仿生或非常規力學特性的結構化軟材料，研究結構化軟材料的製備方法、非線性細觀力學模型、失效機理及實驗技術，探索在生講墓捆醫器件及組織工程領域中的應用;
3. 發展柔性可延展電子器件及系統的力學設計新理念，建立力學分析的理論模型及計算方法。
學術成果
至今已獲得授權的中國發明專利5項、美國發明專利3項，出版學術專著1部，發表SCI論文150餘篇，其中以判潤射通訊作者在《Science》、《Nature》、《Nature Materials》、《Nature Electronics》、《Nature Reviews Materials》、《Nature Communications》、《Science Advances》、糠晚舟享《PNAS》、《JMPS》、疊櫃《Advanced Materials》、《ACS Nano》等期刊發表高水平學術論文80餘篇。十餘篇論文被《Science》、《Nature》、《Nature Materials》、《Nature Electronics》、《Nature Reviews Materials》、《Science Advances》等期刊選為封面文章。這些研究成果被《Nature》、《Science》、《Nature Materials》、《PNAS》、《Nano Today》等期刊在Research Highlights、Perspectives或News & Views/Opinions專欄中焦點報道，同時得到ASME News、Chemistry Views、IOP Physics World、Materials Views、MIT Technology Review、Royal Society of Chemistry等專業機構追蹤，還多次受到BBC、Discovery、Fox、Wall Street Journal、參考消息、新華網、人民網盛匪采等國內外重要媒體報道。
代表性論文包括(*表示通訊作者;+表示並列第一作者):
[1] Song H+,Luo G+, Ji Z, Bo R, Xue Z, Yan D, Zhang F, Bai K, Liu J, Cheng X, Pang W, ShenZ, Zhang YH*. Highly-integrated, miniaturized, stretchable electronic systemsbased on stacked multilayer network materials. Science Advances, 2022,8: eabm3785
--- Featured on the cover of March 18,2022 issue of Science Advances
[2] Cheng X, Zhang F, Bo R, Shen Z, Pang W, Jin T,Song H, Xue Z, Zhang YH*. Ananti-fatigue design strategy for 3D ribbon-shaped flexible electronics. Advanced Materials, 2021, 33: 2102684
--- Featured on the Back Cover of Sep 16, 2021issue of Advanced Materials
[3] Liu J+ Yan D+, Pang W, Zhang YH*. Design, Fabrication and Applications of Soft NetworkMaterials. Materials Today, 2021, 49: 324-350
--- Featured on the inner cover ofOctober 2021 issue of Materials Today
[4] Kim BH+, Li K+, Kim JT+, Park Y+, Jang H, WangX, Xie Z, Won SM, Yoon HJ, Lee G, Jang WJ, Lee KH, Chung TS, Jung YH, Heo SY,Lee Y, Kim J, Cai T, Kim Y, Prasopsukh P, Yu Y, Yu X, Avila R, Luan H, Song H,Zhu F, Zhao Y, Chen L, Han SH, Kim J, Oh SJ, Lee H, Lee CH, Huang Y*, ChamorroLP*, Zhang YH*, Rogers JA*.Three-Dimensional Electronic Microfliers Inspired by Wind-Dispersed Seeds. Nature,2021, 597: 503-510
--- Featured on the cover of Sep 23,2021 issue of Nature
--- Highlighted by Nature (Vol 597,2021, 480-481), "Seed-inspired vehicles take flight".
[5] Zhang H, Wu J, Fang DN*, Zhang YH*. Hierarchical mechanical metamaterials built withscalable tristable elements for ternary logic operation and amplitudemodulation. Science Advances, 2021, 7: eabf1966
[6] Wu J, Yao S, Zhang H, Man W, Bai Z, Zhang F,Wang X, Fang DN*, Zhang YH*. Liquidcrystal elastomer metamaterials with giant biaxial thermal shrinkage forenhancing skin regeneration. Advanced Materials, 2021, 33:2106175
--- Featured as Editor's Choice
[7] LiuJ, Yan D, Zhang YH*. Mechanics ofunusual soft network materials with rotatable structural nodes. Journalof the Mechanics and Physics of Solids, 2021, 146: 104210
[8] GuoX+, Ni X+, Li J+, Zhang H, Zhang F, Yu H, Wu J, Bai Y, Lei H, Huang Y, RogersJA*, Zhang YH*. Designing mechanicalmetamaterials with kirigami-inspired, hierarchical constructions for giantpositive and negative thermal expansion. Advanced Materials, 2021, 33:2004919
---Featured on the Front Cover of Jan 21, 2021 issue of Advanced Materials
[9] Bai K, Cheng X, Xue Z, Song H, Sang L, Liu F, Zhang F, Luo X, Huang W, Huang Y, Zhang YH*. Geometrically reconfigurable 3D mesostructures and electromagnetic devices through a rational bottom-up design strategy. Science Advances, 2020, 6: eabb7417
[10] Yan D+, Chang J+, Zhang H, Liu J, Song H, Xue Z, Zhang F, Zhang YH*. Soft Three-Dimensional Network Materials with Rational Bio-mimetic Designs. Nature Communications, 2020, 11: 1180
[11] Pang W, Cheng X, Zhao H, Guo X, Ji Z, Li G, Liang Y, Xue Z, Song H, Zhang F, Xu Z, Sang L, Huang W, Li T, Zhang YH*. Electro-mechanically controlled assembly of reconfigurable 3D mesostructures and electronic devices based on dielectric elastomer platforms. National Science Review, 2020, 7: 342-354
[12] Fan Z+, Yang Y+, Zhang F, Xu Z, Zhao H, Wang T, Song H, Huang Y*, Rogers JA*, Zhang YH*. Inverse design strategies for 3D surfaces formed by mechanically guided assembly. Advanced Materials, 2020, 32: 1908424
--- Featured on the Frontispiece of April 9, 2020 issue of Advanced Materials
[13] Liu Y+, Wang X+, Xu Y, Xue Z, Zhang Y, Ning X, Cheng X, Xue Y, Lu D, Zhang Q, Zhang F, Liu J, Guo X, Hwang KC, Huang Y*, Rogers JA*, Zhang YH*. Harnessing the interface mechanics of hard films and soft substrates for 3D assembly by controlled buckling. Proceedings of the National Academy of Sciences of the United States of America, 2019, 116: 15368-15377
[14] Cheng X, Zhang YH*. Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving and Buckling Approaches. Advanced Materials, 2019, 31: 1901895
--- Featured on the Inside Front Cover of Sep 6, 2019 issue of Advanced Materials
[15] Luo G+, Fu H+, Cheng X, Bai K, Shi L, He X, Rogers JA, Huang Y, Zhang YH*. Mechanics of bistable cross-shaped structures through loading-path controlled 3D assembly. Journal of the Mechanics and Physics of Solids, 2019, 129: 261-277
[16] Han M+, Wang H+, Yang Y, Liang C, Bai W, Yan Z, Li H, Xue Y, Wang X, Akar B, Zhao H, Luan H, Lim J, Kandela I, Ameer GA, Zhang YH*, Huang Y*, Rogers JA*. Three-dimensional piezoelectric polymer microsystems for vibrational energy harvesting, robotic prosthetic interfaces, and biomedical implants. Nature Electronics, 2019, 2: 26-35
--- Featured on the cover of January issue of Nature Electronics
--- Highlighted by Nature Electronics (Vol 2, 2019, 15-16), "3D piezoelectric microsystems pop up".
[17] Zhang H, Guo X, Wu J, Fang DN*, Zhang YH*. Soft Mechanical Metamaterials with Unusual Swelling Behavior and Tunable Stress-strain curves. Science Advances, 2018, 4, eaar8535
[18] Fu H+, Nan K+, Bai W, Huang W, Bai K, Lu L, Zhou C, Liu YP, Liu F, Wang J, Han M, Yan Z, Luan H, Zhang YJ, Zhang YT, Zhao J, Cheng X, Li M, Lee JW, Liu Y, Fang D, Li X, Huang YG*, Zhang YH*, Rogers JA*. Morphable 3D Mesostructures and Microelectronic Devices by Multistable Buckling Mechanics. Nature Materials, 2018, 17: 268-276
--- Featured on the cover of March 2018 issue of Nature Materials
[19] Fan Z, Hwang KC*, Rogers JA, Huang YG, Zhang YH*. A double perturbation method of postbuckling analysis in 2D curved beams for assembly of 3D ribbon-shaped structures. Journal of the Mechanics and Physics of Solids, 2018, 111: 215-238
[20] Zhang YH*, Zhang F, Yan Z, Ma Q, Li XL, Huang YG, Rogers JA*. Printing, Folding and assembly methods for forming 3D mesostructures in advanced materials. Nature Reviews Materials, 2017, 2: 17019
--- Featured on the cover of April 2017 issue of Nature Reviews Materials
[21] Ma Q, Cheng H, Jang KI, Luan H, Hwang KC, Rogers JA, Huang YG, Zhang YH*. A nonlinear mechanics model of bio-inspired hierarchical lattice materials consisting of horseshoe microstructures. Journal of the Mechanics and Physics of Solids, 2016, 90: 179-202
[22] Ma Q, Zhang YH*. Mechanics of fractal-inspired horseshoe microstructures for applications in stretchable electronics. Journal of Applied Mechanics, 2016, 83: 111008
--- Awarded the ASME Melville Medal, the highest ASME honor for the best original paper which has been published in the ASME Transactions during the two calendar years immediately preceding the year of the award
[23] Xu S+, Yan Z+, Jang KI, Huang W, Fu HR, Kim JH, Wei ZJ, Flavin M, McCracken J, Wang RH, Badea A, Liu Y, Xiao DQ, Zhou GY, Lee JW, Chung HU, Cheng HY, Ren W, Banks A, Li XL, Paik U, Nuzzo RG, Huang YG*, Zhang YH*, Rogers JA*. Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling. Science, 2015, 347: 154-159
--- Featured on the Cover of Jan 9, 2015 issue of Science
--- Highlighted by Science (Vol 347, 2015, 130-131), "Three-dimensional nanostructures pop up".
--- Highlighted by Nature (Vol 517, 2015, 247), "Silicon buckles to form 3D shapes".
[24] Zhang YH+, Yan Z+, Nan KW, Xiao DQ, Liu YH, Luan HW, Fu HR, Wang XZ, Yang QL, Wang JC, Ren W, Si HZ, Liu F, Yang LH, Li HJ, Wang JT, Guo XL, Luo HY, Wang L, Huang YG*, Rogers JA*. A mechanically driven form of Kirigami as a route to 3D mesostructures in micro/nanomembranes. Proceedings of the National Academy of Sciences of the United States of America, 2015, 112, 11757-11764
[25] Xu S+, Zhang YH+, Jia L+, Mathewson KE+, Jang KI, Kim JH, Fu HR, Huang X, Chava P, Wang RH, Bhole S, Wang LZ, Na YJ, Guan Y, Flavin M, Han ZS, Huang YG*, Rogers JA*. Soft Microfluidic Assemblies of Sensors, Circuits and Radios for the Skin. Science, 2014, 344: 70-74
--- This work was highlighted as an item and feature image in the News of the Week on the Science website.
學術期刊兼職
《Science Advances》:Associate Editor;
《Mechanics of Materials》:Associate Editor;
《ASME-Journal of Applied Mechanics》:Associate Editor;
《Research》:Associate Editor;
《Current Opinion in Solid State & Materials Science》編委;
《Proceedings of the Royal Society A》編委;
《npj Flexible Electronics》編委;
《Theoretical and Applied Mechanics Letters》編委;
《固體力學學報》編委;
《SCIENCE CHINA Technological Sciences》中英文版青年編委;
學會兼職
國際工程科學協會，執委會成員(Member, SES Board of Directors);
中國力學學會軟物質力學工作組，副組長;
中國力學學會電子電磁器件力學工作組，副組長;
中國硅酸鹽學會微納技術分會，理事;
中國複合材料學會智能複合材料專業委員會，委員。
主要榮譽
2021年9月，獲得獲第三屆"科學探索獎"(前沿交叉領域)。
2020年，科睿唯安高被引學者(交叉學科)。
2020年，北京地區廣受關注學術論文(力學學科)，北京市科協。
2019年，美國機械工程師協會Thomas J.R. Hughes青年學者獎。
2019年，清華大學第八屆青年教師教學大賽(工科組)一等獎。
2018年，國際工程科學協會Young Investigator Medal。
2018年，美國機械工程師協會Sia Nemat-Nasser早期職業生涯獎。
2017年，Eshelby青年力學教授獎。
2017年，清華大學"學術新人獎"。
2017年，清華大學年度教學優秀獎。
2017年，美國機械工程師協會最高論文獎Melville Medal。
2017年，國家自然科學基金委優秀青年基金。
2017年，美國機械工程師協會Journal of Applied Mechanics Award。
2016年，入選《麻省理工學院技術評論》全球35位35歲以下創新者(MIT TR35)。
2016年，香港求是科技基金會"求是傑出青年學者獎"。
2010年，首屆教育部博士研究生學術新人獎。
參考來源
- ↑ 祝賀！TAML編委清華大學張一慧教授喜獲第三屆「科學探索獎」 ,澎湃, 2021-09-14